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This article reports on the commercial ramp-up of laser-integrated photonic integrated circuits (PICs) designed specifically to meet the escalating bandwidth and power efficiency demands of AI data centers. By enabling monolithic integration of optical components, these chips address critical bottlenecks in scaling AI infrastructure beyond current 800G to 1.6T data rates.
NewPhotonics and Tower Semiconductor Ramp Up Optical Engine Production
NewPhotonics and Tower Semiconductor began high-volume shipments of laser-integrated, serviceable optical engine PICs for artificial intelligence infrastructure, meeting demand for high-bandwidth, energy-efficient optical interconnects. Shipping volume production PICs support data rates from 800G to 1.6T, with future manufacturing planned at 6.4T for scale-out and scale-up architectures.
Tower Semiconductor and NewPhotonics have begun high-volume shipments of photonic integrated circuit optical engines, delivering 800G to 1.6T data transmission capacity for artificial intelligence infrastructure. The companies are commercializing a manufacturing process for these chips using Tower’s PH18DA platform, which enables monolithic integration of lasers, modulators, and detectors…
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