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This study addresses the critical bandwidth bottlenecks in AI data centers by enabling heterogeneous integration of diverse material systems onto silicon photonics platforms via micro-transfer printing. By combining III-V semiconductors and lithium niobate with CMOS-compatible technologies, this approach offers a scalable path to building high-speed photonic interconnects essential for next-generation artificial intelligence infrastructure.

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IEEE Study Highlights How Micro-Transfer Printing Can Lead to Advanced Silicon Photonics

The Quantum InsiderJuly 20, 20264 min read

Insider Brief Press release – Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and therefore are being explored for future artificial intelligence infrastructure. However, heterogenous integration of multiple material systems remains a challenge. Now, researchers show how micro-transfer printing can enable highly versatile heterogenous integration […]

Researchers from Ghent University and imec highlighted micro-transfer printing as a method for integrating different material systems into silicon photonics platforms. The study shows that micro-transfer printing can enable heterogeneous integration of materials such as III-V semiconductors and lithium niobate with CMOS-compatible photonic technologies. The approach could support future photonic systems for applications including AI infrastructure, communications, quantum technologies, and advanced computing. Press release – Silicon photonics has emerged…

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