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Broadcom CEO Hock Tan identifies available capital as the primary bottleneck for future AI expansion, surpassing previous hardware constraints like wafer and memory shortages. This shift highlights the increasing financial intensity required to scale advanced semiconductor manufacturing and supply chains essential for next-generation AI infrastructure.

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Broadcom CEO Says Capital Is Biggest Hurdle to AI Growth

36KrOctober 12, 20261 min read

According to reports, Broadcom CEO Hock Tan stated that as AI continues to develop, capital will become the company's biggest constraint. He noted that while the company is overcoming shortages in wafers and memory chips, capital remains the primary limiting factor.

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