aiqbench takeChips & Infra

Huiyi Intelligence's significant capital raise underscores growing investor confidence in embodied AI hardware, specifically focusing on high-performance computing chips essential for scaling robotic applications. The funding will directly support R&D for next-generation silicon and the expansion of an industrial ecosystem, marking a pivotal step in bridging the gap between advanced AI algorithms and physical execution.

Sources covering36Kr, Latent Space, LessWrong, Tower Semiconductor

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Huiyi Intelligence Raises Over 2.5 Billion Yuan in Equity Financing This Year

36KrOctober 22, 20261 min read

36Kr learned recently that embodied AI high-performance computing chip company Huiyi Intelligence announced that, with the completion of its Pre-B+ and B rounds, the company's cumulative equity financing scale for 2026 has exceeded 2.5 billion yuan. This round was led by Beijing Artificial Intelligence Industrial Investment Fund, with participation from government funds and market-oriented investment institutions including Beijing Robot Industry Development Investment Fund, Yishan Capital, Zhengxin Valley Capital, Jinpu Investment, Construction Investment, Huatai Baoli, Huimuyuanlun, Shanghe Momentum Fund, National Artificial Intelligence Industrial Investment Fund, among others; existing shareholders such as Shunwei Capital, Yuansheng Capital, Kaihui Fund, SenseTime Guoxiang Capital, Bohua Industry Investment, National Automotive Investment, Langmafeng VC, 37 Interactive Entertainment, Shengyi Capital, Xinglian Capital, and Zhuoyuan Asia Capital continued to increase their stakes. This round of financing will be primarily used for the R&D of next-generation embodied AI high-performance computing chips and accelerating scaled delivery and industrial ecosystem construction.

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