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This article focuses on Nexstrom's development of equipment to manufacture 2D transition-metal dichalcogenides (TMDs) at scale for advanced chip fabrication. The technology addresses critical scaling limits in silicon transistors by enabling the direct growth of atomically thin semiconductors on standard 300mm wafers, a key step toward next-generation computing hardware.

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Singapore’s Nexstrom wants to bring 2D semiconductors to chip fabs

TechCrunchSeptember 22, 20263 min read

Singapore-based Nexstrom has raised new funding to develop equipment that could help chipmakers manufacture 2D semiconductor materials at scale.

For decades, chipmakers have sought to make semiconductors faster by shrinking silicon transistors and packing more of them on each chip. But shrinking transistors comes with its own problems: controlling electron flow becomes harder, which exacerbates problems such as leakage, power loss, and heat. Nexstrom, a semiconductor startup incubated by Xora Innovation, thinks using two-dimensional (2D) materials instead of silicon is one…

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