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This research presents a scalable fabrication method for epitaxial NbN/AlN/NbN Josephson junctions, addressing key coherence limitations in superconducting qubits by minimizing amorphous dielectric volume. The study demonstrates high-quality junction performance across a wide range of critical current densities while maintaining electrical stability during wet etching processes. These findings offer a promising pathway for advancing nitride-based quantum hardware with improved integration efficiency.
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Sidewall spacer passivated epitaxial NbN/AlN/NbN Josephson junctions for superconducting qubit applications

arXiv2 min read

arXiv:2610.04820v1 Announce Type: new Abstract: Epitaxial NbN/AlN/NbN Josephson junctions are promising alternatives to conventional Al/AlO$_x$/Al junctions for superconducting qubits due to their crystalline tunnel barriers and the high transition temperature of NbN. However, their integration into quantum circuits typically requires complex fabrication processes involving amorphous interlayer dielectrics, which can degrade qubit coherence times. To address these issues, we developed sidewall spacer passivated epitaxial NbN/AlN/NbN junctions using a fabrication process that reduces both the volume of amorphous dielectric material and fabrication complexity. The fabricated junctions exhibited a large gap voltage of approximately 5.6 mV and low subgap leakage currents. By varying the thickness of the AlN tunnel barrier, high-quality junctions were fabricated over a wide range of critical current densities ${\it J}_c$, from 0.3 to 10$^4$ A/cm$^2$. In addition, the comparison of the current-voltage characteristics before and after buffered hydrofluoric acid treatment indicated that the wet etching process did not degrade the electrical characteristics of the junctions. These results establish a scalable fabrication process for epitaxial Josephson junctions and provide a promising platform for high-coherence nitride-based superconducting qubits.

Abstract:Epitaxial NbN/AlN/NbN Josephson junctions are promising alternatives to conventional Al/AlO$_x$/Al junctions for superconducting qubits due to their crystalline tunnel barriers and the high transition temperature of NbN. However, their integration into quantum circuits typically requires complex fabrication processes involving amorphous interlayer dielectrics, which can degrade qubit coherence times. To address these issues, we developed sidewall spacer passivated epitaxial NbN/AlN/NbN junctions using a fabrication process that reduces both the volume of amorphous dielectric material and fabrication complexity. The fabricated junctions exhibited a large gap voltage of approximately 5.6 mV and low subgap leakage currents. By varying the thickness of the AlN tunnel barrier, high-quality junctions were fabricated over a wide range of critical current densities ${\it J}_c$, from 0.3 to 10$^4$ A/cm$^2$. In addition, the comparison of the current-voltage characteristics before and after buffered hydrofluoric acid treatment indicated that the wet etching process did not degrade the electrical characteristics of the junctions. These results establish a scalable fabrication process for epitaxial Josephson junctions and provide a promising platform for high-coherence nitride-based superconducting qubits.

Quantum Physics (quant-ph); Superconductivity (cond-mat.supr-con)

arXiv:2610.04820 [quant-ph]

(or arXiv:2610.04820v1 [quant-ph] for this version)

https://doi.org/10.48550/arXiv.2610.04820 Focus to learn more arXiv-issued DOI via DataCite (pending registration)

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Full text under the publisher's open licence · 268 words

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