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This article details Rigetti Computing's integration of on-chip thermometers using Dayem bridges to achieve millikelvin temperature precision for superconducting qubits, a critical advancement in cryogenic hardware stability. By leveraging the intrinsic properties of these weak links, researchers have established a scalable and calibration-free method that directly addresses engineering bottlenecks in quantum circuit optimization.
Rigetti Superconducting Bridges Track Qubit Temperature With Millikelvin Precision

Accurate knowledge of the on-chip temperature is essential for understanding and optimizing the performance of superconducting qubits, yet direct thermometry at millikelvin temperatures remains challenging. Researchers demonstrate a complementary on-chip thermometry method based on superconducting Dayem bridges integrated on the same chip as transmon qubits, obtaining a local, quantitative measure of the chip temperature from I-V measurements.
Researchers at Rigetti Computing have developed a new method for measuring temperature on superconducting qubit chips with millikelvin precision. The team integrated superconducting Dayem bridges directly onto the same chip as transmon qubits, enabling localized temperature readings without complex calibration procedures. By measuring the critical current of these Dayem bridges via I-V measurements, researchers obtain a quantitative measure of chip temperature. The work demonstrates agreement between the Dayem bridge thermometer and established qubit thermometry techniques, validating its reliability. These results establish integrated Dayem bridges as a simple and scalable tool for cryogenic hardware development and…
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