aiqbench analysis
This research identifies readout amplifier dissipation as the dominant thermal bottleneck limiting scalability in large superconducting quantum systems, correcting previous models that overlooked these specific heat sources. By rigorously accounting for active dissipation and passive conduction alongside Joule heating, the study provides a corrected roadmap toward single-fridge configurations capable of supporting 10k-qubit architectures. The analysis offers critical insights into necessary tradeoffs between refrigeration platforms and optical approaches to overcome fundamental thermal limits in cryogenic quantum hardware.
Revisiting Thermal Scalability for Large-Scale Superconducting Quantum Systems
arXiv:2608.00990v1 Announce Type: new Abstract: The readout amplification chain imposes a critical thermal scalability bottleneck in large-scale superconducting quantum systems. This happens through three mechanisms: amplifier dissipation, passive conduction through bias wiring and Joule heating within that same wiring. These terms are absent or only partially represented in several prior system-level thermal-scalability models, leading to bottleneck misidentification and scalability overestimation. In this work, we improve upon previous system-level heat estimation models by fully accounting for the major heat sources in modern cryogenic quantum systems including the active dissipation, passive conduction, and Joule heating in the readout amplifier module. Our analysis demonstrates that amplifier-associated heat emerges as the dominant thermal bottleneck that fundamentally alters the thermal landscape of modern large-scale cryogenic systems. We explore various technology options and their tradeoffs to identify configurations that reduce this critical heat load and improve scalability. Finally, we evaluate forward-looking system configurations, including larger refrigeration platforms and optical approaches, and analyze forward-looking pathways toward single-fridge 10k-qubit cryogenic systems.
Abstract:The readout amplification chain imposes a critical thermal scalability bottleneck in large-scale superconducting quantum systems. This happens through three mechanisms: amplifier dissipation, passive conduction through bias wiring and Joule heating within that same wiring. These terms are absent or only partially represented in several prior system-level thermal-scalability models, leading to bottleneck misidentification and scalability overestimation. In this work, we improve upon previous system-level heat estimation models by fully accounting for the major heat sources in modern cryogenic quantum systems including the active dissipation, passive conduction, and Joule heating in the readout amplifier module. Our analysis demonstrates that amplifier-associated heat emerges as the dominant thermal bottleneck that fundamentally alters the thermal landscape of modern large-scale cryogenic systems. We explore various technology options and their tradeoffs to identify configurations that reduce this critical heat load and improve scalability. Finally, we evaluate forward-looking system configurations, including larger refrigeration platforms and optical approaches, and analyze forward-looking pathways toward single-fridge 10k-qubit cryogenic systems.
arXiv:2608.00990 [quant-ph]
(or arXiv:2608.00990v1 [quant-ph] for this version)
https://doi.org/10.48550/arXiv.2608.00990 Focus to learn more arXiv-issued DOI via DataCite (pending registration)
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