aiqbench takeChips & Infra

NVIDIA's potential shift to custom base dies for NVHBM signals a strategic move toward deeper vertical integration in high-bandwidth memory production, leveraging TSMC's 3nm process while partners like Samsung adopt the architecture. This development highlights the evolving supply chain dynamics where chipmakers increasingly define their own DRAM core specifications rather than relying on standard industry blocks. For AI infrastructure builders, this trend suggests future HBM generations may offer more tailored performance and bandwidth characteristics optimized specifically for NVIDIA's GPU architectures.

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NVIDIA to Produce Custom NVHBM? Industry Insiders Say Custom Base Dies Are Becoming the Trend

36KrOctober 19, 20261 min read

Reports indicate that NVIDIA has requested Samsung Electronics, SK Hynix, and Micron Technology to use TSMC's 3nm process for base dies (BaseDie) to manufacture NVHBM (NVIDIA's custom HBM technology, where HBM stands for High Bandwidth Memory), while core dies (CoreDie) will utilize sixth-generation DRAM (Dynamic Random Access Memory) technology. Samsung Electronics has decided to accept NVIDIA's technical requirements. Regarding the authenticity of this matter, on October 19, Samsung Electronics responded that it does not comment on matters involving its customers. (China Business Network)

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