aiqbench analysis

This research addresses critical bottlenecks in scaling photonic interconnects for AI systems by leveraging fine-pitch Cu-Cu hybrid bonding and high-density silicon interposers to reduce parasitic effects. The work focuses on solving specific integration challenges such as thermal management, alignment accuracy, and defect mitigation within densely packed 2.5D heterogeneous chiplet architectures. These advancements are essential for enabling the co-packaged optics required to meet the rising bandwidth demands of next-generation AI accelerators.