aiqbench takeChips & Infra

As transistor scaling hits physical limits, advanced packaging like EMIB has shifted from a secondary function to a critical enabler for the high bandwidth and energy efficiency required by AI workloads. This technology now allows system-level performance gains by tightly interconnecting multiple chips, fundamentally changing how compute architectures are designed. The industry's focus has thus moved from purely monolithic scaling to integrating system-level innovation as the primary driver for future computing power.

Sources coveringIntel, livenews.co.nz

What this isA model's reading of the article and related coverage, written for aiqbench. Not the publisher's words.

Meet the Intel Pioneer Behind EMIB Chip Packaging

IntelMay 28, 20266 min read

Ravi Mahajan is a foundational figure behind Intel’s leadership in advanced packaging. As an Intel Fellow and director of Substrate and Advanced Packaging Pathfinding at Intel Foundry, he has spent more than 30 years advancing semiconductor packaging technologies.Often referred to as the inventor of EMIB (Embedded Multi-die Interconnect Bridge), Mahajan led the development of this … The post Meet the Intel Pioneer Behind EMIB Chip Packaging appeared first on Newsroom.

Ravi Mahajan discusses the idea for a simple silicon bridge and why it is becoming a foundational technology for the AI era. Ravi Mahajan is a foundational figure behind Intel’s leadership in advanced packaging. As an Intel Fellow and director of Substrate and Advanced Packaging Pathfinding at Intel Foundry, he has spent more than 30 years advancing semiconductor packaging technologies. Often referred to as the inventor of EMIB (Embedded Multi-die Interconnect Bridge), Mahajan led the development of this groundbreaking technology that enables multiple chips to be tightly interconnected within a single package, an increasingly important capability as AI workloads drive demand for higher performance, bandwidth and energy efficiency. In this conversation, he reflects on his…

Excerpt shown under the publisher's RSS terms · 115 words · full text and figures are on the publisher's site

Read at Intel ↗Ask about this article