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This research applies machine learning to enhance the resolution of scanning probe microscopy images, directly addressing the sub-nm metrology challenges required for advanced semiconductor manufacturing. By leveraging neural networks and transfer learning, the study demonstrates a viable path to reducing imaging time without sacrificing throughput in high-volume production environments. The work represents a significant intersection where AI algorithms solve critical physical measurement bottlenecks in chip fabrication.
Image resolution enhancement for advanced semiconductor nodes
arXiv:2610.05809v1 Announce Type: new Abstract: Advanced semiconductor nodes are pushing the limits of feature sizes and require metrology with sub-nm resolution without compromising on the throughput as needed for in-line process control. Recently, high-throughput scanning probe microscopy (SPM) based metrology and inspection tools capable of meeting these needs have been introduced to the market and qualified for use in HVM. While innovative measurement methods and tool architecture have allowed for a leap of improvement in throughput, the next step in further reducing imaging time can be obtained through the application of machine learning for enhancing the resolution of measured images for extraction of relevant parameters. In this work, we provide the general framework under which a neural network-based resolution enhancer is designed and used for SPM images. We showcase the effectiveness of this framework using measurements performed on Line/Space structures with a pitch of 200 nm. For the reusability of a pre-developed pre-trained model, we additionally leverage transfer learning and show that a new model for slightly differing structures can be re-trained and calibrated with a smaller data set of measurements performed on Line/Space structures with a pitch of 100 nm.
Abstract:Advanced semiconductor nodes are pushing the limits of feature sizes and require metrology with sub-nm resolution without compromising on the throughput as needed for in-line process control. Recently, high-throughput scanning probe microscopy (SPM) based metrology and inspection tools capable of meeting these needs have been introduced to the market and qualified for use in HVM. While innovative measurement methods and tool architecture have allowed for a leap of improvement in throughput, the next step in further reducing imaging time can be obtained through the application of machine learning for enhancing the resolution of measured images for extraction of relevant parameters. In this work, we provide the general framework under which a neural network-based resolution enhancer is designed and used for SPM images. We showcase the effectiveness of this framework using measurements performed on Line/Space structures with a pitch of 200 nm. For the reusability of a pre-developed pre-trained model, we additionally leverage transfer learning and show that a new model for slightly differing structures can be re-trained and calibrated with a smaller data set of measurements performed on Line/Space structures with a pitch of 100 nm.
Machine Learning (cs.LG)
arXiv:2610.05809 [cs.LG]
(or arXiv:2610.05809v1 [cs.LG] for this version)
https://doi.org/10.48550/arXiv.2610.05809 Focus to learn more arXiv-issued DOI via DataCite (pending registration)
https://doi.org/10.1117/12.3011239 Focus to learn more DOI(s) linking to related resources
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