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This study pinpoints specific nanoscale fabrication geometries and surface oxides as the primary drivers of performance variance in superconducting transmon qubits. By isolating these microscopic defects through double-blind characterization, researchers provide critical data for optimizing lithographic etching and surface passivation protocols to improve coherence times. These findings are essential for scaling fault-tolerant quantum processors by reducing device-to-device inconsistency at the material level.

Sources coveringQuantum Computing Report, arXiv

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Fermilab SQMS Center Identifies Microscopic Origins of Qubit Performance Variance Across Superconducting Transmons

Quantum Computing ReportOctober 2, 20262 min read

Researchers at Fermilab's SQMS Center and collaborators identified microscopic material defects causing performance variations in superconducting qubits. Their study found that nanoscale fabrication geometries, surface oxides, and energy relaxation times are directly correlated. Specifically, single-nanometer shifts in surface oxide thickness, substrate trench depths below 20 nanometers, and sidewall etch profiles can cause up to a twofold variation in qubit performance. The post Fermilab SQMS Center Identifies Microscopic Origins of Qubit Performance Variance Across Superconducting Transmons appeared first on Quantum Computing Report.

A superconducting qubit chip seen inside the X-ray photoelectron spectroscopy analysis chamber. Researchers at the Fermi National Accelerator Laboratory-led Superconducting Quantum Materials and Systems Center (SQMS), in collaboration with Rigetti Computing, the National Institute…

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