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This research demonstrates how AI agents, specifically the "Astra" workflow, can autonomously optimize thermal structures in 2D CFET inverters by balancing electrothermal constraints and electrical costs. The study validates that AI-driven design proposals successfully reduce peak temperature rises while quantifying associated trade-offs in current loss and metal resistance. Such autonomous workflows represent a significant step toward accelerating hardware architecture innovation through integrated scientific reasoning.
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AI for Science with GPT-6 Astra: Thermal Design and Electrothermal Analysis of 2D CFET

arXiv2 min read

arXiv:2609.17123v1 Announce Type: cross Abstract: Thermal optimization of 2D CFET inverters requires testing structural proposals against their electrical costs. We examine these research tasks using an AI agent workflow within a supplied electrothermal model. At 12 nm, Astra selects a redistributed source-interconnect geometry, while a coordinating agent proposes a substrate-directed heat-removal path. The combined design reduces peak temperature rise by 1.67 K at fixed metal volume and 20 {\mu}W. A subsequent metal-resistance sensitivity gives about 0.6-K inverter cooling alongside a 2% nFET on-current loss. Effective contact-length scaling further shows that lower temperature can accompany higher thermal resistance when current falls. Reproduction identifies agreeing implementations and retains a 104.95-K failure for diagnosis. These results show that an AI scientist workflow can propose thermal structures, test them under common constraints, and quantify their electrical cost.

Abstract:Thermal optimization of 2D CFET inverters requires testing structural proposals against their electrical costs. We examine these research tasks using an AI agent workflow within a supplied electrothermal model. At 12 nm, Astra selects a redistributed source-interconnect geometry, while a coordinating agent proposes a substrate-directed heat-removal path. The combined design reduces peak temperature rise by 1.67 K at fixed metal volume and 20 {\mu}W. A subsequent metal-resistance sensitivity gives about 0.6-K inverter cooling alongside a 2% nFET on-current loss. Effective contact-length scaling further shows that lower temperature can accompany higher thermal resistance when current falls. Reproduction identifies agreeing implementations and retains a 104.95-K failure for diagnosis. These results show that an AI scientist workflow can propose thermal structures, test them under common constraints, and quantify their electrical cost.

Materials Science (cond-mat.mtrl-sci); Artificial Intelligence (cs.AI); Hardware Architecture (cs.AR)

arXiv:2609.17123 [cond-mat.mtrl-sci]

(or arXiv:2609.17123v1 [cond-mat.mtrl-sci] for this version)

https://doi.org/10.48550/arXiv.2609.17123 Focus to learn more arXiv-issued DOI via DataCite (pending registration)

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Full text under the publisher's open licence · 228 words

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