Microlead Nano: Plans to Raise Up to 4.944 Billion Yuan via Private Placement for Semiconductor Equipment Projects

36Kr reports that Microlead Nano announced plans to issue A-share stocks to specific targets, raising a total of no more than 4.944 billion yuan. After deducting issuance costs, the funds will be allocated to the Wuxi Advanced Semiconductor Equipment Industrialization and Iteration Project, the Central China Advanced Semiconductor Equipment Industrialization Project, the Cutting-edge Thin Film Deposition Technology R&D Center Project, and working capital supplementation. Specifically, 3.225 billion yuan is earmarked for the cutting-edge thin film deposition technology R&D center project, 729 million yuan for the Wuxi project, 289 million yuan for the Central China project, and 700 million yuan for working capital.