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The announcement is a manufacturing milestone: Innolight's first Near-Package Optics device has entered early production on Tower's silicon photonics process, with more products taped out on 300mm wafers. For AI readers, the relevant point is that NPO places optics closer to the compute package, which requires far higher channel counts than pluggable modules. Whether NPO becomes a standard architecture will depend on yield, packaging, and volume production, none of which this press release quantifies.
Tower Semiconductor and Innolight Advance High-Performance Near-Package Optics for AI Infrastructure
Home » Press Releases Tower Semiconductor and Innolight Advance High-Performance Near-Package Optics for AI Infrastructure Leveraging Tower’s 200mm and 300mm Silicon Photonics platforms, the collaboration supports multiple generations of Near-Packaged Optics development for AI infrastructure MIGDAL HAEMEK, Israel and SUZHOU, China, November 3, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor […]
MIGDAL HAEMEK, Israel and SUZHOU, China, November 3, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, and Innolight, a leading provider of optical connectivity solutions for data center and AI infrastructure applications, today announced their continued collaboration on emerging Near-Package Optics (NPO) applications. The collaboration combines Innolight’s expertise in optical interconnect solutions with Tower’s high-volume 200mm and 300mm Silicon Photonics manufacturing platforms…
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