analiza aiqbench

QTREX has demonstrated a scalable method to convert 3D-printed dielectric material into conductive graphene-like structures, effectively integrating stray-photon shielding directly into quantum processor packaging. This approach eliminates the need for discrete components or external assembly steps, addressing critical scaling challenges by reclaiming cryostat space and protecting superconducting circuits from disruptive radiation. The ability to precisely control carbon conversion through laser parameters establishes a repeatable manufacturing process essential for building larger-scale quantum systems.