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MIT researchers have successfully developed a wafer-scale fabrication process for silicon-photonics chips that are both mechanically flexible and optically transparent, overcoming previous material limitations. This scalable approach enables mass production of devices suitable for emerging applications like conformal health monitors and transparent augmented-reality displays. The breakthrough validates the viability of integrating these unique optical and mechanical properties into practical hardware using existing manufacturing tools.
MIT builds a way to mass-produce flexible photonic chips
MIT researchers developed a wafer-scale process to fabricate flexible, transparent photonic chips—enabling applications like wearables.
MIT scientists have developed a wafer-scale process to fabricate silicon-photonics chips that are both mechanically flexible and optically transparent, a combination previously unattainable with traditional materials. This scalable technique moves beyond limited lab demonstrations to enable mass production of advanced microchips for emerging applications. “We’ve now developed a wafer-scale process that produces wafers that are mechanically flexible and optically transparent, enabling novel applications that weren’t previously possible with silicon photonics,” says Jelena Notaros, the Robert J. Shillman Career Development Associate Professor of Electrical Engineering and Computer Science at MIT. The new chips could lead to discreet health monitors conforming to the body and transparent augmented-reality displays for pilots. The fabrication process relies on 300-millimeter wafers, a significant…
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