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Midea's inclusion in NVIDIA's MGX ecosystem highlights the critical shift toward high-density liquid cooling required for next-generation Blackwell and Rubin architectures. This partnership underscores that as AI compute power scales, thermal management infrastructure has evolved from a supporting role to a central constraint defining system performance and deployment viability. The move signals industry-wide standardization around 45°C operating temperatures, marking a pivotal moment where hardware design and cooling solutions are inextricably linked for future data centers.

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Midea Joins NVIDIA MGX Ecosystem

36Kr15 octombrie 20261 min de cititArticolul și perspectiva sunt în engleză.

At the 2026 OCP Global Summit held in San Jose, California from October 12 to 15, NVIDIA unveiled its NVIDIA MGX AI Factory ecosystem and partner list for the next-generation Vera Rubin platform, with Midea listed as a thermal management partner. MGX is an open hardware foundation built around Blackwell, Vera Rubin, and subsequent AI computing platforms, spanning server OEM/ODM, liquid cooling, power supplies, power distribution, and data center infrastructure. Reports indicate that as Vera Rubin platform rack power density continues to rise and 45°C high-temperature liquid cooling becomes the industry standard, MGX ecosystem partners have the opportunity to engage early in thermal management specification alignment, CDU and cold source adaptation, and system-level validation.

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