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HiPi resolves the fabrication trade-off in piezoresistive tactile sensing by integrating a commercial PCB stack that maintains high-fidelity readout while eliminating manual assembly. By achieving a 220 Hz readout rate and significantly improving contact geometry metrics, the system enables scalable, dense sensing for complex bimanual robotic manipulation. This hardware stack advancement makes high-quality tactile feedback more accessible for deploying multi-fingered robotic systems.
HiPi: Reproducible High-Fidelity Piezoresistive Sensors for Robotic Manipulation
arXiv:2606.11372v1 Announce Type: new Abstract: Piezoresistive tactile sensors are attractive for robotic manipulation because they are thin, lightweight, low-cost, and scalable to dense large-area sensing. However, existing systems still face a practical trade-off: recent reproducible designs emphasize accessibility and ease of reproduction, whereas high-fidelity readout architectures remain more difficult to fabricate, assemble, and deploy. We present HiPi, a reproducible high-fidelity piezoresistive sensing system for robotic manipulation. Building on a low-crosstalk readout principle, HiPi redesigns the complete hardware stack around reproducibility, deployability, and multi-sensor scalability. The system includes a compact readout PCB compatible with commercial PCB fabrication and assembly services, eliminating manual soldering; a smaller and lower-cost STM32-based MCU module; an optimized communication pipeline that achieves 220 Hz readout in a bimanual setup with four dense tactile arrays (2048 taxels in total); and FPCB-based conductive layers that simplify sensor fabrication and stacking. Experiments with structured 3D-printed contact patterns show that HiPi preserves contact geometry substantially better than a reproducible baseline, improving the average IoU from 0.428 to 0.797 and the average Dice score from 0.539 to 0.886. These results suggest that HiPi bridges an important gap between reproducible fabrication and high-fidelity readout, making dense piezoresistive tactile sensing more practical for bimanual manipulation and multi-fingered robotic systems.
Abstract:Piezoresistive tactile sensors are attractive for robotic manipulation because they are thin, lightweight, low-cost, and scalable to dense large-area sensing. However, existing systems still face a practical trade-off: recent reproducible designs emphasize accessibility and ease of reproduction, whereas high-fidelity readout architectures remain more difficult to fabricate, assemble, and deploy. We present HiPi, a reproducible high-fidelity piezoresistive sensing system for robotic manipulation. Building on a low-crosstalk readout principle, HiPi redesigns the complete hardware stack around reproducibility, deployability, and multi-sensor scalability. The system includes a compact readout PCB compatible with commercial PCB fabrication and assembly services, eliminating manual soldering; a smaller and lower-cost STM32-based MCU module; an optimized communication pipeline that achieves 220 Hz readout in a bimanual setup with four dense tactile arrays (2048 taxels in total); and FPCB-based conductive layers that simplify sensor fabrication and stacking. Experiments with structured 3D-printed contact patterns show that HiPi preserves contact geometry substantially better than a reproducible baseline, improving the average IoU from 0.428 to 0.797 and the average Dice score from 0.539 to 0.886. These results suggest that HiPi bridges an important gap between reproducible fabrication and high-fidelity readout, making dense piezoresistive tactile sensing more practical for bimanual manipulation and multi-fingered robotic systems.
Robotics (cs.RO)
arXiv:2606.11372 [cs.RO]
(or arXiv:2606.11372v1 [cs.RO] for this version)
https://doi.org/10.48550/arXiv.2606.11372 Focus to learn more arXiv-issued DOI via DataCite (pending registration)
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