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Fujitsu has demonstrated a functional diamond-spin QPU prototype that integrates tin-vacancy centers directly into photonic integrated circuits, marking a significant step toward scalable solid-state quantum architectures. This platform operates at 1.55 Kelvin, offering a thermally advantageous alternative to the extreme cryogenic requirements of superconducting processors while leveraging SnV's superior photon brightness for efficient optical interconnects. The collaboration with QuTech and the University of Tokyo establishes a modular pathway for inter-chip quantum state transfer using carbon-13 nuclear spins as local memory.

Sursă care acoperăQuantum Computing Report

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Fujitsu Fabricates Diamond-Spin QPU Prototype Integrating Tin-Vacancy Centers and Photonic ICs

Quantum Computing Report8 septembrie 20263 min de cititArticolul și perspectiva sunt în engleză.

Fujitsu has fabricated a prototype diamond-spin quantum processing unit (QPU) integrating tin-vacancy (SnV) color centers into photonic integrated circuits (PICs), operating at a warmer cryogenic temperature of -271.6°C. This architecture addresses scaling challenges through heterogeneous material bonding and nanometer-scale diamond thinning, utilizing SnV centers for their reduced sensitivity to electric field noise and higher photon emission brightness compared to traditional nitrogen-vacancy centers. Fujitsu plans to develop a multi-module prototype by 2027, aiming for a 1,000 logical qubit system by FY2035, and is also working on linking this with their superconducting hardware for a heterogeneous quantum computing architecture. The post Fujitsu Fabricates Diamond-Spin QPU Prototype Integrating Tin-Vacancy Centers and Photonic ICs appeared first on Quantum Computing Report.

Japanese IT group Fujitsu Limited has announced a physical hardware milestone in solid-state quantum architectures, fabricating a working prototype diamond-spin quantum processing unit (QPU) that integrates tin-vacancy (SnV) color centers directly into photonic integrated circuits (PICs). Developed in collaboration with QuTech…

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