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This research addresses a critical reliability gap in chiplet-based AI systems-on-chip by formally transitioning from standard functional testing to probabilistic assurance of long-term post-assembly performance. By framing die screening as a constrained inference problem, the study introduces Bayesian models that quantify failure risks and provide provable safety guarantees for complex heterogeneous architectures. The work is essential for advancing hardware architecture standards required to sustain high-yield manufacturing in next-generation AI accelerators where traditional Known Good Die metrics are insufficient.
Formal Foundations for Known Good Reliable Die Screening in Chiplet-Based AI Systems-on-Chip
arXiv:2607.20141v1 Announce Type: cross Abstract: The rapid growth of chiplet-based artificial intelligence systems-on-chip (SoCs) has exposed a fundamental gap in semiconductor test methodology. Existing Known Good Die (KGD) screening guarantees pre-assembly functional correctness, yet it offers no probabilistic assurance of post-assembly reliability lifetime. To address this limitation, the present work formalizes the transition from KGD to Known Good Reliable Die (KGRD) screening as a constrained inference problem over incomplete pre-assembly observability. Building upon this formulation, four interlocking contributions are presented: (i) a Bayesian probabilistic risk model that maps pre-assembly telemetry to post-assembly failure likelihood with a quantified observability bias bound; (ii) a safety-gated decision architecture that provides a provable post-assembly failure probability guarantee; (iii) uncertainty-aware disposition boundaries derived from Bayes-optimal decision theory; and (iv) a constrained closed-loop feedback mechanism that delivers consistent model improvement without violating reliability constraints. A Monte Carlo simulation study on N = 4,000 synthetic dies verifies all four theoretical properties and confirms that the safety guarantee holds uniformly across the full range of tested gate threshold.
Abstract:The rapid growth of chiplet-based artificial intelligence systems-on-chip (SoCs) has exposed a fundamental gap in semiconductor test methodology. Existing Known Good Die (KGD) screening guarantees pre-assembly functional correctness, yet it offers no probabilistic assurance of post-assembly reliability lifetime. To address this limitation, the present work formalizes the transition from KGD to Known Good Reliable Die (KGRD) screening as a constrained inference problem over incomplete pre-assembly observability. Building upon this formulation, four interlocking contributions are presented: (i) a Bayesian probabilistic risk model that maps pre-assembly telemetry to post-assembly failure likelihood with a quantified observability bias bound; (ii) a safety-gated decision architecture that provides a provable post-assembly failure probability guarantee; (iii) uncertainty-aware disposition boundaries derived from Bayes-optimal decision theory; and (iv) a constrained closed-loop feedback mechanism that delivers consistent model improvement without violating reliability constraints. A Monte Carlo simulation study on N = 4,000 synthetic dies verifies all four theoretical properties and confirms that the safety guarantee holds uniformly across the full range of tested gate threshold.
Hardware Architecture (cs.AR); Artificial Intelligence (cs.AI)
arXiv:2607.20141 [cs.AR]
(or arXiv:2607.20141v1 [cs.AR] for this version)
https://doi.org/10.48550/arXiv.2607.20141 Focus to learn more arXiv-issued DOI via DataCite (pending registration)
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