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This article focuses on the industrialization of silicon spin qubits using FD-SOI technology and 300mm wafers, marking a critical step toward scalable quantum processor manufacturing. The strengthened collaboration between Quobly, CEA-Leti, and STMicroelectronics aims to refine process flows specifically for quantum applications rather than general consumer electronics or networking standards.
CEA-Leti’s 2016 silicon qubit paves way for Quobly’s QSOI
CEA-Leti’s 2016 demonstration of a silicon qubit, fabricated with CMOS on a 300mm wafer, underpins Quobly’s QSOI development & strengthened collaboration.
In 2016, researchers at CEA-Leti demonstrated a silicon spin qubit fabricated on a 300 mm wafer using standard industrial processes, a foundational step now bolstered by a strengthened collaboration with Quobly, the company says. The French quantum computing company, spun out from CEA-Leti and CNRS in 2022, will use the FAMES Pilot Line to refine new process flows for its QSOI architecture, which combines silicon spin qubits with FD-SOI technology and is being industrialized with STMicroelectronics. “Quobly was founded on more than 15 years of research at…
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