Goldman Sachs: High-Bandwidth Flash Could Crack AI 'Memory Wall', With Potential Market Size Up to $150 Billion

Goldman Sachs released a research report on the 12th stating that as demand for AI inference grows rapidly, insufficient storage capacity is becoming an important bottleneck constraining computing power efficiency. New NAND technologies such as high-bandwidth flash (HBF) are expected to alleviate this 'memory wall' problem and significantly reduce AI infrastructure costs. The bank estimates that if GPU adoption rates reach 15% to 50%, the potential market size for HBF could range from $40 billion to $150 billion. Goldman Sachs maintains a 'buy' rating for Sandisk and SK Hynix due to their leading advantages in HBF technology; Samsung Electronics is also expected to benefit. In contrast, Micron's direct benefits are lower as its business focus leans towards DRAM and HBM, so the bank maintains a 'neutral' rating.