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This development highlights a strategic shift in semiconductor supply chains where NVIDIA prioritizes performance consistency over traditional foundry competition, forcing Samsung to adopt TSMC's 3nm process for its HBM base dies. The move underscores the increasing specialization of advanced packaging and memory manufacturing, where process unification becomes critical for next-gen AI accelerator reliability. For the AI industry, this signals that yield optimization and die-level uniformity may soon outweigh foundry brand loyalty in high-stakes memory production.

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Samsung reportedly to use TSMC's 3nm process for NVIDIA's next-gen HBM base die

36Kr18 octombrie 20261 min de cititArticolul și perspectiva sunt în engleză.

According to reports, Samsung Electronics plans to adopt TSMC's 3nm process to manufacture NVIDIA's next-generation custom high-bandwidth memory (HBM) base dies. It is reported that NVIDIA wants suppliers to unify manufacturing processes to ensure performance consistency and has requested that Samsung, SK Hynix, and Micron use TSMC's 3nm process for NVHBM base die production. This move marks Samsung's first collaboration with TSMC in the HBM manufacturing stage.

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