analiza aiqbench
The article details Huawei's roadmap for its 2027 Kirin chip, focusing on architectural advancements like the logic folding Tao design and specific AI-centric components such as the Da Vinci NPU and Kirin AI ISP. While it outlines a decade-long evolution plan, the core subject remains the development of next-generation semiconductor hardware specifically engineered to support advanced AI workloads within mobile terminals.
Huawei's Xu Songyu: Next-Generation Kirin 2027 Chip Is Ready
At the 2026 Kirin media briefing, Xu Songyu, Minister of Wireless Terminal Chip Products Management at Huawei Semiconductor Business, unveiled the detailed architecture of the logic folding Tao chip Kirin 9050 Pro for the first time. The design features a new generation Lingxi CPU, Maliang GPU, Da Vinci architecture NPU, Kirin AI ISP, Balong AI Modem, FFTS function flow task scheduler, audio-video processor, security processor, and Lingxi micro-core collaboration. Xu revealed that the next-generation Kirin 2027 chip is also ready, with all test results meeting expectations to date, ensuring sustainable evolution over the next decade (logic folding). Specific implementation stages and required technologies for each point will be developed and discussed gradually.
Citește articolul complet pe 36Kr
