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The article focuses on Samsung and SK Hynix unveiling next-generation memory architectures like HBM4E specifically to support physical AI, cloud computing, and edge applications. While the event is a general semiconductor exhibition, the core subject matter regarding high-bandwidth memory and 3D structures is directly foundational to advancing AI hardware infrastructure.

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Samsung, SK Hynix to Showcase Next-Gen Memory Tech at Upcoming 2026 Korea Semiconductor Exhibition

36Kr13 octombrie 20261 min de cititArticolul și perspectiva sunt în engleză.

The Korea Semiconductor Industry Association announced that the 2026 Korea Semiconductor Exhibition (SEDEX 2026) will be held for three days from the 14th to the 16th at the COEX Convention Center in Gangnam, Seoul. Approximately 300 companies, including Samsung Electronics and SK Hynix, will participate with a total of 888 booths. Samsung Electronics will display next-generation memory structures and products for cloud computing, edge computing, and physical AI applications. These include high-bandwidth memory (HBM), mobile image sensors, mobile processors, high-reliability semiconductors for automotive use, semiconductor foundry solutions, and 3D memory structures. SK Hynix will also unveil next-generation memory technology, including seventh-generation HBM (HBM4E) and high-bandwidth flash memory (HBF). (Caixin Global)

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