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The exhibition highlights critical advancements in HBM4E memory stacks and physical AI chips, which are foundational infrastructure for scaling large language models and next-generation data centers. While the event covers broader consumer electronics, the core narrative focuses on the supply chain innovations required to support the "Silicon Intelligence" era of artificial intelligence.

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Korea's Semiconductor Show Opens Today; HBM and Physical AI Chips Take Center Stage

36Kr12 octombrie 20261 min de cititArticolul și perspectiva sunt în engleză.

The Korea Semiconductor Industry Association announced on October 12 that the 28th Korea Semiconductor Exhibition will be held from October 14 to 16 under the theme 'Into the Era of Silicon Intelligence.' The event is setting a new record in scale, featuring 300 exhibitors—an increase of about 70 from last year—and 888 booths. SK Hynix will unveil its next-generation HBM4E (seventh-generation HBM) and high-bandwidth flash (HBF) technologies, alongside flagship products for servers, PCs, mobile devices, DRAM, NAND flash, and SSDs. Major Korean domestic firms in core materials, components, and equipment, including Jusung Engineering, SEMES, and Hanmi Semiconductor, will also participate.

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